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TFMM5..0
Vishay Telefunken
Photo Modules for PCM Remote Control Systems
Available types for different carrier frequencies
Type TFMM 5300 TFMM 5360 TFMM 5380 TFMM 5560 fo 30 kHz 36 kHz 38 kHz 56 kHz Type TFMM 5330 TFMM 5370 TFMM 5400 fo 33 kHz 36.7 kHz 40 kHz
Description
The TFMM5..0 - series are miniaturized receivers for infrared remote control systems. PIN diode and preamplifier are assembled on PC board, the epoxy package is designed as IR filter. The demodulated output signal can directly be decoded by a microprocessor. The main benefit is the reliable function even in disturbed ambient and the protection against uncontrolled output pulses.
95 10266
Features
D Photo detector and preamplifier in one package D Output active low D Internal filter for PCM frequency D High immunity against ambient light D High shielding against electric field disturbance D 5 Volt supply voltage, low power consumption D TTL and CMOS compatibility D Continuous transmission possible (tpi/Tx0.4) D SMD
Block Diagram
2 Input Control Circuit VS
100 kW 3 OUT
PIN AGC Band Pass Demodulator 1
GND
94 8136
Document Number 82003 Rev. 3, 14-Sep-00
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TFMM5..0
Vishay Telefunken Absolute Maximum Ratings
Tamb = 25_C Parameter Supply Voltage Supply Current Output Voltage Output Current Junction Temperature Storage Temperature Range Operating Temperature Range Power Consumption Soldering Temperature Test Conditions (Pin 2) (Pin 2) (Pin 3) (Pin 3) Symbol VS IS VO IO Tj Tstg Tamb Ptot Tsd Value -0.3...6.0 5 -0.3...6.0 5 100 -40...+85 -25...+85 50 230 Unit V mA V mA C C C mW C
(Tamb x 85 C) t x 10 s, 1 mm from case
Basic Characteristics
Tamb = 25_C Parameter Su ly Supply Current (Pin 2) Transmission Distance Output Voltage Low (Pin 3) Irradiance (30 - 40 kHz) Irradiance (56 kHz) Irradiance Directivity Test Conditions VS = 5 V, Ev = 0 VS = 5 V, Ev = 40 klx, sunlight Ev = 0, test signal see fig.7, IR diode TSIP5201, IF = 1.5 A IOSL = 0.5 mA,Ee = 0.7 mW/m2, f = fo, tp/T = 0.4 Pulse width tolerance: tpo = tpii160 ms, ms test signal (see fig.7) Angle of half transmission distance Symbol ISD ISH d VOSL Ee min Ee min Ee max 1/2 20 40 0.6 0.8 Min 0.4 Typ 0.5 1.0 35 Max 0.8 Unit mA mA m mV mW/m 2 mW/m 2 W/m 2 deg
250
Application Circuit
330 W *) 2 TFM. 5..0 TSUS 5... TSIP 5... 3 4.7 mF *) >10 kW optional + 5V **)
mC
1
94 8137
GND *) only necessary to suppress power supply disturbances **) tolerated supply voltage range : 4.5V< VS < 5.5 V
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Document Number 82003 Rev. 3, 14-Sep-00
TFMM5..0
Vishay Telefunken Typical Characteristics (Tamb = 25_C unless otherwise specified)
Ee min - Threshold Irradiance ( mW/m 2 ) 1.3
95 10188
1.0 /e E - Rel. Responsitivity
4
0.8
3
0.6
2
0.4 0.2 0.0 0.7 0.8 0.9 1.0 1.1 1.2
1
E e min
f = f0"5% Df ( 3 dB ) = f0 / 10
0 0 0.4 0.8 1.2 1.6 2.0 f / f0 - Relative Frequency E - Field Strength of Disturbance ( kV / m )
94 8143
Figure 1. Frequency Dependence of Responsivity
1000 tpo - Output Pulse Length ( m s )
Figure 4. Sensitivity vs. Electric Field Disturbances
100 f = f0 10 10 kHz 1 100 Hz
800
Input Burst Duration
600
400 200 l = 950 nm, Optical Test Signal, Fig.7 0 0.1 1 10 100 1000 ) 10000
Ee min - Threshold Irradiance ( mW/m2 )
0.1 0.1
95 10194
1
10
100
1000
95 10187
Ee - Irradiance (
mW / m2
DVs RMS - AC Voltage on DC Supply Voltage ( mV )
Figure 2. Sensitivity in Dark Ambient
10
Figure 5. Sensitivity vs. Supply Voltage Disturbances
1.0 Sensitivity in dark Ambient
Ee min - Threshold Irradiance ( mW/m 2 )
Ee min - Threshold Irradiance ( mW/m 2 ) 100
0.8
0.6
1
0.4 0.2 0.0 -30
0.1 0.01
95 10189
0.1
1
10 W / m2 )
0
30
60
90
E - Irradiance (
95 10195
Tamb - Ambient Temperature ( C )
Figure 3. Sensitivity in Bright Ambient
Figure 6. Sensitivity vs. Ambient Temperature
Document Number 82003 Rev. 3, 14-Sep-00
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TFMM5..0
Vishay Telefunken
Ee Optical Test Signal ( IR diode TSIP 5201, IF = 1.5 A, 30 pulses, f = f0, T = 10 ms ) T on ,T off - Output Pulse Length ( ms ) 1.0
0.8 Ton 0.6 Toff
t tpi * T * tpi w 400 ms is recommended for optimal function Output Signal tpo = tpi "160 ms
94 8133
0.4 0.2 0.0 0.1 1 10
VO VOH VOL
l = 950 nm, Optical Test Signal, Fig.8 10000
100
1000
t tpo
95 10191
Ee - Irradiance ( mW / m2 )
Figure 7. Output Function
Ee Optical Test Signal 1.0 Is - Supply Current ( mA )
Figure 10. Output Pulse Diagram
0.8
Vs = 5 V
600 ms T = 60 ms
600 ms
t
0.6
94 8134
0.4 0.2 0.0 -30
VO VOH VOL
Output Signal, ( see Fig.10 )
0
30
60
90
Ton
Toff
t
94 8150
Tamb - Ambient Temperature ( C )
Figure 8. Output Function
Figure 11. Supply Current vs. Ambient Temperature
Ee min - Threshold Irradiance ( mW/m 2 )
8
S ( l )rel - Relative Spectral Sensitivity
1.2 1.0 0.8 0.6 0.4 0.2 0 750
6
4
2
0 0.05
95 10190
0.15
0.25
0.35
0.45
94 8408
850
950
1050
1150
tp / T - Duty Cycle
l - Wavelength ( nm )
Figure 9. Sensitivity vs. Duty Cycle
Figure 12. Relative Spectral Sensitivity vs. Wavelength
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Document Number 82003 Rev. 3, 14-Sep-00
TFMM5..0
Vishay Telefunken
-20 -30 -10 0 10 20 fy fx -40 -40 -30 -20 -10 0 10 20
0.6
0.4
0.2
0
0.2
0.4
0.6
95 10192 95 10193
0.6
0.4
0.2
0
0.2
0.4
0.6
drel - Relative Transmission Distance
drel - Relative Transmission Distance
Figure 13. Vertical Directivity y
Figure 14. Horizontal Directivity x
Soldering Pads for Reflow Soldering
2.2 1.6 1.7 1.7 GND1 (Case GND) 2.8 2.8 2.2 2.0
1.6
1.6
Note: Mounting area on the PC board for TFMM.... series has to be solid grounded and has to be insulated by resist.
95 10185
Pinning
Light Receiving Window Case GND Vcc GND1
Out
95 10186
GND2
Document Number 82003 Rev. 3, 14-Sep-00
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TFMM5..0
Vishay Telefunken Dimensions in mm
15904
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Document Number 82003 Rev. 3, 14-Sep-00
TFMM5..0
Vishay Telefunken Operating Instructions
Reflow Soldering DReflow soldering must be done within 48 hoursstored under max. 30C, 80% RH after opening envelop DRecommended soldering paste (composition: SN 63%, Pb 37%) Melting temperature 178 to 192C DApply solder paste to the specified soldering padsusing a dispenser or by screen printing. DRecommended thickness of metal mask is 0.2 mmfor screen printing. DThe recommended reflow furnace is a combinationtype with upper and lowewr heaters. DSet the furnace temperatures for pre-heating andheating in accordance with the reflow temperatureprofile as schown below. Excercise extreme care tokeep the maximum temperature below 230_C. Thefollowing temperature profile means the temperature at the device surface. Since temperature difference occurs between the work and the surface of the circuit board depending on the pes of circuit board or reflow furnace, the operating conditions should be verified prior to start of operation. DHandling after reflow should be done only after the work surface has been cooled off.
300 max. 240 C 250 215 C 200 Temperature ( C )
Manual Soldering DUse the 6/4 solder or the solder containing silver. DUse a soldering iron of 25 W or smaller. Adjust the temperature of the soldering iron below 300_C. DFinish soldering within three seconds. DHandle products only after the temperature is cooled off. Cleaning DPerform cleaning after soldering strictly in conformance to the following conditions: Cleaning agent: 2-propanol (isopropyl alcohol). Commercially available grades (industrial use) should be used. Demineralized or distilled water having a resistivity of not less than 500 mW corresponding to a conductivity of 2 mS/m. DTemperature and time: 30 seconds under the temperature below 50_C or 3 minutes below 30_C. DUltrasonic cleaning: Below 20 W.
94 8625
ca. 230 C
10 s
150 max. 160 C max. 40 s 100 90 - 120 s full line : typical dotted line : process limits
50 2-4 K / s
Lead Temperature
0 50 100 Time ( s ) 150 200 250
Document Number 82003 Rev. 3, 14-Sep-00
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TFMM5..0
Vishay Telefunken Taping Specifications
(1) Shape and dimensions of reels (in accordance with EIAJRC-1009B); unit in mm
13.5 12.5 24.8 23.2 2.6 1.4
101 99
332 328
2.5 1.5
95 10204
Label
18.4 16.4
(2)
Dimensions of tape
95 10200
8.8 8.6
4.1 3.9
R=0.80 0.75
1.85 1.65
7,6 7,4 8.4 8.2 16.3 15.7
0.35 0.25 3.7 12.1 11.9
2.05 1.95 Direction of Pulling Out
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Document Number 82003 Rev. 3, 14-Sep-00
TFMM5..0
Vishay Telefunken
(3) Configuration of tapes
Empty End < > < > < > 40 mm min. 40 mm min. 200 mm min. Parts mounted Empty Leader Start
(4)
Quantity
1000 pcs. per reel
Packing
(1) Dampproof packing Products will be packed in anti-humidity aluminium bags to prevent the products from moisture absorption during transportation and storage. Each bag contains
Aluminiumbag
a desiccant with moisture indicators. In the event bags absorb moisture, the indicators change their color from blue to pink.
Desiccant
Label
Reel
95 10203
(2) Recommended method of storage Dry box storage is recommended to prevent the parts from moisture absorption. The following conditions In case of moisture absorption the device will recover to the former conditon by drying under the following recommended conditions:
should be preserved if dry boxes are not available. Storage temperature: 10 - 30_C Storage humidity: 60% RH max taped version: untaped version: 60_C/48 h 125_C/2 h
Lot Number
3 digits 5 18 Last digit of calendar year Month code
Lot number is labeled on the aluminum bag and also indicated on the reverse side of each part.
Document Number 82003 Rev. 3, 14-Sep-00
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TFMM5..0
Vishay Telefunken Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay-Telefunken products for any unintended or unauthorized application, the buyer shall indemnify Vishay-Telefunken against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 )7131 67 2831, Fax number: 49 ( 0 )7131 67 2423
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Document Number 82003 Rev. 3, 14-Sep-00

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